Why ACF Bonding is Popular in Electronics Industry?

In many respects, ACF Bonding is the newest star on the block. The technique has gained a lot of popularity in electronics assembly and fabrication because of several advantages. Today a wide range of electronics from cell phones to CMOS camera modules is manufactured using the technique.

One of the main reasons of the polarity of ACF Bonding is the fact that the process does not involve lead as a component. This means that the process is extremely environment friendly. To understand this, it is important to understand how lead based connection techniques harm the environment and how the process of ACF Bonding changes the game.

Even a simple device like an MP3 player contains a number of components that are connected to the main board through some connection technique. In the case of larger devices, the number of connections could go into thousands. For many years, the connection technique of choice was lead based solders. The process was cheap, in terms of both technology and raw materials. In addition, the process is simple enough to be reduced to a set of simple steps that could be accomplished by a robot. Thus, soldering was the go-to technique for connecting components to the motherboard. Al other connections between the components and wires were also accomplished through the lead based solders.

When it comes to disposal of the dead and discarded electronics, the preferred way is to open the casing and remove the components. In better cases, this process is automated. However, in vast majority of cases, this process is accomplished by hand. The lead solder is disposed into trash where it finds its way to the ground and groundwater sources. The result is a contamination that causes lead poisoning.

ACF Bonding ensures that this lead poisoning is controlled and that the dangers posed by lead solders are minimized.